72对棒还原炉内硅沉积速率及能耗分析

Analysis of Silicon Deposition Rate and Energy Consumption in 72-pair Rod Reduction Furnace

  • 摘要: 多晶硅还原炉是生产多晶硅的反应器。为了提高多晶硅产量、降低能耗,依赖TCS-H2体系下化学气相沉积过程中发生的气相与表面化学反应机理,展开进气速度和进出口面积比对72对棒多晶硅还原炉硅沉积速率及能耗影响的数值模拟。结果表明:硅沉积速率随着进气速度的增加而提高,且进气速度的增大有助于提升沉积均匀性,平均硅沉积速率基本维持在0.001 4~0.001 5 kg/(m2·s)。进出口面积比对硅沉积速率的影响较小,在其值为0.6时,平均沉积速率达到最大值0.001 495 kg/(m2·s)。在炉体内壁面发射率ε=0.55下,进气速度较低时,外圈硅棒与壁面的辐射换热占主导地位,故外侧硅棒能耗较大;进气速度较高时,硅棒与炉内气流的换热增强,使得湍流度高的硅棒能耗较大。在ε=0.25时,总能耗随着进出气面积比的增大略微减小,在进出口面积比为1.4时总能耗达到最低。

     

    Abstract: The polysilicon reduction furnace serves as the core reactor for polysilicon production.To optimize the output and reduce the energy consumption, this study investigates the effects of inlet gas velocity and inlet/outlet area ratio on silicon deposition rate and energy consumption in a 72-pair rod polysilicon reduction furnace through numerical simulations, based on the gas-phase and surface reaction mechanisms of chemical vapor deposition(CVD) in the TCS-H2 system.Results indicate that the silicon deposition rate increases with higher inlet gas velocity, which also improves deposition uniformity, with the average deposition rate remaining within 0.001 4~0.001 5 kg/(m2·s).The inlet/outlet area ratio has a minor influence on the deposition rate, with the average rate peaking at 0.001 495 kg/(m2·s) when the ratio is 0.6.When the wall emissivity(ε) of the furnace is 0.55,at lower inlet gas velocities, radiative heat transfer between the outer rods and the furnace wall dominates, leading to higher energy consumption for the outer rods.When the intake gas velocity is relatively high, the heat exchange between the silicon rods and the gas flow in the furnace intensifies, resulting in higher energy consumption for the silicon rods with high turbulence.When ε=0.25,the total energy consumption slightly decreases as the inlet/outlet area ratio increases, reaching its minimum at a ratio of 1.4.

     

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